Copper thickness and conductive pattern

Copper Plating

You can get a final copper thickness of 18μm, 35μm, 105μm or 70µm at WEdirekt. Here is an overview of which copper thickness you can order depending on the type of manufacture and/or production location.

Please note that an end copper of 18µm is only possible in conjunction with etching technology without a copper plating process.

For the outer layers we start with a thinner film, which is then built up in the production process to reach your required final copper thickness. The copper in the hole is 20 microns on average. The thinnest permissible copper in the hole is 18μm.

For the final copper thickness we ask you to consider the following:

  • The inner layers correspond to IPC 2221B Table 10-1
  • The outer layers correspond to IPC 2221B Table 10-2

Copper surface design tip

In order to ensure a uniform deposition of metal for your PCB, your layout should have a uniform copper distribution. We encourage you to fill free space with copper balancing.

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You may wonder why we create the outer layers using a copper foil, which is not the same as the final copper thickness. Due to the processes used, copper is plated on to the board. This means that, for example, the use of an 18μm copper foil results in 35μm nominal final copper thickness.

The final copper thickness is governed by the tables stated in IPC 2221A above. Please note that the actual thickness of your copper PCB may be thinner. In the PCB industry, we use the terminology, final copper thickness, however this is nominal and the actual result may turn out thinner. This is not the rule, but can occur in the standard process. If you need to define your PCB copper thickness, we encourage you to send us an enquiry to info@wedirekt.de. We will pass your request on to your local Würth CBT representative.

Conductive Pattern

The following overview shows our WEdirekt specifications for the conductive pattern structures and distances. These apply regardless of how your circuit board is manufactured.

Outer Layers (18µm final copper) 85µm structures 100µm structures 125µm structures 150µm structures
Track width ≥ 85µm ≥ 100µm ≥ 125µm ≥ 150µm
Spacing track
to track
≥ 85µm ≥ 100µm ≥ 125µm ≥ 150µm
Spacing pad
to pad
≥ 170µm ≥ 170µm ≥ 170µm ≥ 170µm
Spacing track
to pad
≥ 85µm ≥ 100µm ≥ 125µm ≥ 150µm
Outer Layers (35µm final copper) 100µm structures 125µm structures 150µm structures
Track width ≥ 100µm ≥ 125µm ≥ 150µm
Spacing track to track ≥ 100µm ≥ 125µm ≥ 150µm
Spacing pad to pad ≥ 170µm ≥ 170µm ≥ 170µm
Spacing track to pad ≥ 100µm ≥ 125µm ≥ 150µm
Outer Layers (70µm final copper) 192µm structures
Track width ≥ 150µm
Spacing track to track ≥ 192µm
Spacing pad to pad ≥ 192µm
Spacing track to pad ≥ 192µm
Outer Layers (105µm final copper) 250µm structures
Track width ≥ 150µm
Spacing track to track ≥ 250µm
Spacing pad to pad ≥ 250µm
Spacing track to pad ≥ 250µm
Inner Layer Structures 85µm 100µm 125µm 150µm 192µm 250µm
Final copper thickness 18µm* 18µm, 35µm 18µm, 35µm 18µm, 35µm 18µm, 35µm, 70µm 18µm, 35µm, 70µm, 105µm
*Please note that an end copper of 18µm is only possible in conjunction with etching technology without a copper plating process.

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