The plugging process is a cost-effective method of closing vias. However, when plugging a relatively large clearance requirement must be considered in your PCB data. The clearance to the neighbouring solderable surface should be as detailed below.
|finished diameter||Plugged via mask||
Clearance between mask
and solderable surface
|≤ 0,15 mm||0,40 mm||0,15 mm|
|≤ 0,25 mm||0,50 mm||0,15 mm|
|0,30 mm – 0,55 mm||EndØ + 0,35 mm||0,15 mm|
|≤ 0,65 mm||EndØ + 0,45 mm||0,15 mm|